
TATSUTA Functional Film
Thermosetting Conductive Adhesive Film
產品編號CBF series
Conductive Bonding under High Temperatures
Thermosetting Conductive Bonding Film
Recommended Applications: Smartphones, Laptops/Tablets, Automotive Electronics
Products
・With the introduction of 5G, electronic devices are becoming more densely packed, increasing the importance of noise countermeasures.
・The CBF series is used for FPC implementation of smartphone camera modules and BtoB connectors, offering high heat resistance suitable for automotive applications.
・It maintains stable connection resistance and adhesion strength even in high-temperature environments.