Functional Conductive Paste
Via Flilling Paste (Metalize)
產品編號MPA500 / MP8700
MPA500 （Build-up）
MP8700 （No Press neened、Still solderble after grinding）
Products
Excellent via filling capability （No Void）
Board to Board hot press process
Anylayers Build-up process
Hot press and printing process significantly improve production efficiency
No electroplating required, compliant with environmental ESG standards
