SF-PC3100-C has a ultrathin Cu foil as a metallic thin layer: 

1. Total body of 1.2 um, high conductivity and shield properties. 

2. Providing better embedding COF for LC module and ACF joint reliability because it has shape keeping property. 

3. Lead free soldering applicable. 

4. UL approval product as V-0 class (bonding with Kapton 50 H on double sides).